Aixtron purpose of this thread

so hat Felix das umschrieben was im Bereich AI Data Center gerade passiert.

Zum einem die Umstellung von:

1. AC (Wechselstrom) auf 800 HVDC (Gleichstrom)
2. von Kupfer auf Glasfaser und Erhöhung der Übertragungsfrequenz von 200GHz auf bis zu 1.600GHz

Maßgeblicher Treiber Und Taktgeber für beide ist Nvidia auf der Suche nach Sparmöglichkeiten die Abwärme zu reduzieren, damit den Stromverbrauch zu senken und die Übertragungsgeschwindigkeit zu erhöhen. Nvidia hat im März 2026 angekündigt, jeweils 2 Milliarden US-Dollar (insgesamt 4 Milliarden US-Dollar) in die beiden Photonik- und Optikspezialisten Lumentum und zu investieren.

Zweck der Partnerschaften

1. Forschung & Entwicklung: Förderung neuer optischer Technologien und Siliziumphotonik (CPO – Co-Packaged Optics).
2. Kapazitätsausbau: Unterstützung des Aufbaus neuer Fabriken und Produktionsstätten in den USA.
3. Liefersicherheit: Langfristige, mehrjährige Liefer- und Kaufverpflichtungen im Milliardenwert für hochentwickelte Laser- und Netzwerkkomponenten zur Vermeidung von Engpässen bei KI-Rechenzentren.

Andere GPU Hersteller werden folgen (müssen).

Optoelectronic: . It is important to understand that the higher the transmission speed, the larger the die size needs to be, which means more wafers and subsequently Aixtron tools needed.

GaN: The lower the Voltage the more die area is needed, which means more wafers and subsequently Aixtron tools needed.

Architectural changes (meine Definition):

1st LED

1st Iphone mit touchscreen

1st Battery electric vehicle

Solarpanele und Windkraftanlagen zur erneuerbaren Stromerzeugung

Immer dort wo Strom gewandelt/reduziert wird kommen Halbleiter zum Einsatz. Früher Silizium basiert heute zunehmend SiC und GaN basiert weil effizienter.

 ist dabei.

Wer die LED Welle bei Aixtron miterlebt hat, weiß was auf Investierte zukommen könnte.

Gruß

 baggo-mh

2D Materialien werfen Ihre Schatten voraus

Zum einen auf der Aixtron Homepage

Zum anderen in verschiedenen Artikeln die ich gestern recherchiert habe.

MIT engineers “grow” atomically thin transistors on top of computer chips https://news.mit.edu/2023/mit-engineers-2d-materials-compute…

Researchers use graphene encapsulation to grow air-stable 2D superconductors for quantum circuits

https://news.mit.edu/2023/mit-engineers-2d-materials-compute…

Taiwanese academics, in collaboration with TSMC's research department, have overcome a key bottleneck in two-dimensional semiconductors through epitaxial interface engineering.

The greatest value of the new technology lies in establishing a platform that can apply different 2D semiconductor materials, which is expected to enable the development of faster, lower-power electronic components and their perfect integration with existing semiconductor processes.

https://technews.tw/2026/08/06/2d-semiconductor-epitaxial-in…

Da kommt eine ganz neue Generation der Chip Architektur auf uns zu.

Gruß
 baggo-mh

Gestern hat Aixtron auf der Konferenz präsentiert.

Offenbar rechnet man mit bis zu € 480 Millionen Optoelectronic Umsatz in 2027. Als Kunden werden genannt:
- Coherent
- Lumentum
- Nokia
- Broadcom

Letztgenanntes Unternehmen lese ich heute im Zusammenhang mit Aixtron zum ersten Mal. Broadcom bringt heute nach US-Börsenschluss Zahlen zum abgelaufenen Quartal. Wird spannend.

Gruß
 baggo-mh
 

Auf Basis der aktuellen Vertriebspipeline erwartet AIXTRON, das derzeit hohe Niveau des Auftragseingangs in den kommenden Quartalen zu halten oder weiter zu steigern. Unterstützt wird dies durch die Nachfrage nach Optoelektronik und zunehmend auch durch die sich verbessernde Dynamik in der Leistungselektronik.

Sehr sehr starke Aussage und Ausblick auf 2027 imho. Ich denke im call wir das bestätigt.

Gruß
baggo-mh

https://stock3.com/news/marvell-greift-nach-lumentum-mega-deal-um-ki-laser-in-sicht-17359550

Woooooowwwww das wäre ein Hammer!!

Gruß
baggo-mh

Aixtron Q3 call – 29.10.2026

Let me start with my personal Wooooooow moment at the end of the call. There were questions on the sustainability of In/P based laser business versus VCSEL and MicroLED.

In both cases Felix answered that it will be complimentary business if it comes to fruition and he went on to say about MicroLED: “We are in heavy development work with multiple customers. It makes sense you print a GaN/MicroLED on top of a CPU or GPU add a sapphire or SiC interposer add waveguides and you will be able to connect the GPU/CPU with the HBM via an optical interconnect.”

I admit a did not understand all of this yet, but the way he said it was so real, as if this is already in the trial stages and no longer in the lab phase.

The other WOOOOOOOOW moment came on a GaN question. Will you or your competitor win the race for the 300mm GaN fab expansion of the tier 1 supplier announced 2 days ago?

Answer: “We never talk about customers, but we are preparing for sizeable double digit GaN 300 tool orders (for 2 customers – not sure if that was said)   

Gruß
 baggo-mh

3rd WOOOOOOOW momentwas on guidance for 2027……without actually asking for it.

Q: If you reach € 210-220 million in Q4/26 and the order momentum is at the rate of 275 and better in the coming quarters, what prevents you from repeating this in Q1??

A: good logic (from Felix) once you have hired the people, build and ramped the supply chain to the correct level.

Opto

- Exceptionally strong, largest business 68% of order intake in Q3 driven by AI/data center infrastructure buildout.

- Research agency forecasts a further growth of 40% by 2030

- Aixtron sees a broadening customer base from US, Europe initially to now include Japan, Taiwan, Singapore and China.

- tool demand for 6’ (150mm) is lower than expected due to low substrate supply. Therefore customers are ordering tools for 75 and 100mm wafers and the numbers are therefore increasing but they have lower margins than the 6’ G-10.

- 70-80% of Opto tools shipped in 4’ configuration. 2027 6’ share is going down for 30% to 25% while 3’ increases from 15 to 30%. G-10 con be reconfigured to 6’ at a later stage.

Power

beginning of a recovery is being observed

GaN

utilization back to normal. 200 and 300 mm will coexist depending on customer fab configuration. Main driver conversion from 800 V down to 200, 100, 40, 20V due to power efficiency. The first cycle was for 650 chargers. Discussion for volume orders for 200 and 300mm ongoing.

SiC

- demand driver was BEV (battery electric vehicles)

- new industrial applications, SST-solid state transformers

- data center conversion from the transmission lines 2 or 3 KV to 800V

- customers report an outstanding results concerning uniformity

MicroLED

activity is increasing

Financials

- Revenue Q4 bigger than Q3

- All stars aligned (product and regions mix) margin from Q3 (48%) not to be used for 2027 or Q4.

- € 309 million customer advance payments

- maintain or grow order intake in the coming quarters from Q3 (€275 million) level

- 2027 guidance given with full year 26 results on March 4, 2027

- strong service revenue in Q3 came from SiC upgrade cycle from 150 to 200mm

- no share buyback at this stage – too early. Money will be used in the best interest of shareholders.

I am still sitting on the Q&A section

Gruß

baggo-mh

Hier findet man ein transcript des Calls von gestern.

https://finance.yahoo.com/quote/AIXA.F/earnings/AIXA.F-Q3-20…

CEO (Felix Grawert) Regarding the MicroLEDs for the AI, it goes a bit in the same direction as we had earlier in this call, a question regarding the VCSELs. There's quite some heavy work on this research work. We are working together with multiple customers on that one. Again, it would be complementary and an additional market segment to the indium phosphide, what we see. What customers of ours are playing with, or what the vision is, let's put it like this, is to have gallium nitride MicroLEDs. With gallium nitride, we are involved. Gallium nitride MicroLEDs bonded to either the GPU or to the CPU, and then to use, for example, a silicon carbide or a sapphire interposer on which you place both the GPU die, the dies for high bandwidth memory. The vision is to make also the interconnect between the GPU and the high bandwidth memory an optical interconnect.Today, in all the architectures we've been discussing in the last 45 minutes, we spoke about copper interconnects between the GPU and the high bandwidth memory.

Einer der Kunden ist sicherlich ams-Osram

Gruß
 baggo-mh

Felix Grawert

CEO

0:53:01

I think here we have a first evidence now that this is just happening. So our hypothesis of the coexistence of the two wafer sizes is first of all confirmed. Secondly, as you know, we never comment on individual customers. Also not on this one. What I can tell you is that we're preparing for a sizable double-digit number of tools, next year on 300 millimeter. So our 300 millimeter will go into very large volume next year. Not only from one customer, but from more than one customer.

I did hear it correctly.

Gruß
 baggo-mh