Semiconductor Equipment and Materials International (SEMI) said in its report on June 22 that the construction of 19 and 10 fabs would commence this year and next year..The 29 are divided into eight in China, eight in Taiwan, six in North America, three in Europe and the Middle East, two in Japan and two in South Korea. As for 12-inch wafer fabs, construction will commence at 15 and seven sites this year and next year, respectively........ Most of the 29 sites are likely to be equipment-less until 2023. Equipment installation at the other sites is expected to start in the first half of 2022
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