February 05, 2007 09:01 AM Eastern Time
IntellaSys to Showcase ''Triple-Play'' Chip Solutions for Next-Generation Consumer Electronics at IIC/ESC-China
SEAforth™, Indigita® and OnSpec™ Applications to Be Exhibited;
Vendor Seminar Presentation to Address “Embedded Processing in the 21st Century”
IIC/ESC-China
CUPERTINO, Calif.--(BUSINESS WIRE)--IntellaSys today announced it will both exhibit and speak at the IIC/ESC-China trade show and conference scheduled to take place in Shenzhen (March 5-6), Beijing (March 8-9) and Shanghai (March 13-14). Billed as the largest showcase of IC application technologies, embedded solutions and high-end components, the three-city event is expected to draw thousands of engineers who specify advanced chip solutions for their next-generation product designs.
“Our participation in IIC/ESC-China accentuates our pledge to deliver the latest technology and applications information to design engineers throughout the Asia-Pacific region,” said Chet Brown, IntellaSys CEO. “The ‘triple-play” chip solutions that we plan to exhibit will offer an innovative option to maximize performance-per-watt in embedded applications as well as cutting-edge I/O solutions that ensure network and storage security in silicon.”
Brown briefly described the “triple-play” solutions his company will showcase as follows:
1. SEAforth™ Multicore Processors that are backed by more than 200 years of collective development by veteran software/hardware technologists. These revolutionary chip solutions combine A/D and D/A converters with an array of processor cores, each operating at 1 billion instructions/second while collectively dissipating only 250mW.
2. Indigita® Secure Content Processors that manage/route digital audio and video content, enabling Network Attached Storage for HD entertainment networks and easy transformation of IDE hard drives into complete DVRs with full Digital Rights Management (also known as 5C content protection). Newest chip applications enable HD Video Recorders to record directly to hard disk for the professional market and to CompactFlash for the broader consumer market.
3. OnSpec™ Secure Storage Controllers that manage and control content stored on multiple popular Flash card formats or hard disk drives while providing 128-bit AES Hardware Encryption and SHA key authentication. Encrypted data is stored in memory to prevent reading information directly from memory.
IntellaSys will present technical data and applications information on its products at the following IIC/ESC-China exhibit sites: Shenzhen Convention and Exhibition Center (Booth # 2G46); Beijing China World Trade Center (Booth # H20); and Shanghai Mart (Booth # 4M17).
IntellaSys Vendor Seminars
During the three-city, nine-day run of IIC/ESC-China, Joseph C. Wang, IntellaSys VP of Asia-Pacific Sales, will present education-oriented Vendor Seminars titled, “Embedded Processing in the 21st Century.” Wang’s presentations will take place at each of the exhibit sites as follows: March 5th in Shenzhen (Room # 314 at 4:10 PM); March 9th in Beijing (Room # 8B at 2:00 PM): and Shanghai (Room # 2B at 2:00 PM).
About IntellaSys
Operating as an enterprise of The TPL Group, IntellaSys specializes in developing distributed digital media semiconductor solutions via three major product brands: SEAforth™ multicore processors, Indigita® content secure connectivity devices and OnSpec™ secure storage controllers. With headquarters in Cupertino, California, IntellaSys has seven design centers, three of which are in California as well as four others based in Arizona, Colorado, Ohio and Austria. The TPL Group, founded in 1988, focuses on the development, commercialization and management of IP assets. For more information, visit www.intellasys.net.
IntellaSys, SEAforth, OnSpec, and Indigita are trademarks of Technology Properties Limited (TPL). All other trademarks belong to their respective owners.