January 15, 2002, Denver Colorado: NANOPIERCE TECHNOLOGIES, INC. (OTC:BB:NPCT) today announced commencement of WaferPierce™ production and a new operational organization. Dr. Herbert J. Neuhaus has been appointed President and Chief Executive Officer of the newly formed, wholly owned subsidiary NanoPierce Connection Systems, Inc.
NanoPierce Connections Systems, Inc., has been chartered to undertake high volume production WaferPierce™, a revolutionary and enabling semiconductor wafer treatment for ultra-low cost flip-chip without the necessity of wire bonding, conductive adhesives, or soldering. Typical end-use applications of WaferPierce™ include Smart Labels, Smart Cards, and LED arrays. The new subsidiary has taken over all operations and business activities conducted in the Colorado Springs facility effective January 1, 2002. In addition to WaferPierce™ production, NanoPierce Connection Systems will be responsible for licensing and new applications of other NanoPierce technologies to add value to electronic components.
The strategic operational change was prompted, by among other factors, the completion and operational readiness of the Class 1000 WaferPierce™ production cleanroom in Colorado Springs and the recently announced plan to commence production of smart inlays in NanoPierce’s German Subsidiary NanoPierce Card Technologies, GmbH (Press Release dated January 14, 2002).
Mr. Metzinger commented, "WaferPierce™ directly address the needs of the flip-chip market segment of the semiconductor market. Over the next five years Prismark Partners forecasts that the flip chip market will grow at 45% annually, far faster than the overall industry. Specifically, the market for wafer treatment for flip-chip, currently at just over 4 Million wafers per year will skyrocket to 24 Million wafers per year. Moreover, WaferPierce™ offers unique advantages to most rapidly growing segments of the flip chip market. For example, industry leaders have told us that Smart Labels, which are forecast to grow at 122% annually, cannot be produced cost effectively with any other technology.”
"I am very proud to take the helm of this new enterprise, " declared Dr. Neuhaus. "To me it represents the realization of a vision Paul Metzinger and I developed several years ago. Paul and I then laid the foundation, and together our entire team has persevered since. Today the vision remains unchanged and is finally in reach: To transform the entire electronics industry; to make NanoPierce the new industry standard for flip chip.”
Dr. Neuhaus is an expert in materials for semiconductors and electronics packaging. Since 1980, Dr. Neuhaus has been active in the development and characterization of electronic materials and associated manufacturing. Dr. Neuhaus received his Ph.D. degree in Physics from the Massachusetts Institute of Technology. Dr. Neuhaus is associated with numerous professional groups and is the current Materials Subcommittee chair of the National Technical Committee of the International Microelectronics and Packaging Society (IMAPS).
Paul H. Metzinger, President and Chief Executive Officer said, "The new structure will more closely align organizational reality to actual operations which we believe will enhance the successful execution of our Strategic Plan. I have the highest level of confidence that with the increased accountability and responsibility Dr. Neuhaus has assumed, he and his team will exceed their already impressive levels of performance.”
ABOUT NANOPIERCE TECHNOLOGIES, INC.
NanoPierce Technologies, Inc. of Denver, Colorado, USA, is traded on the Nasdaq stock market (OTC:BB:NPCT) as well as on the Frankfurt and Hamburg (OTC:NPI). In addition to the 12 patents it owns, NanoPierce has numerous applications pending, others in preparation, and various other intellectual properties related to NanoPierce’s proprietary NCS (NanoPierce Connection System). This advanced system is designed to provide significant improvement over conventional electrical and mechanical interconnection methods for high-density circuit boards, components, sockets, connectors, semiconductor packaging and electronic systems.
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