Depotwettbewerb USA 25 KW

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Huaneng Power A.
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Perf. seit Threadbeginn:   +1311,55%
 
Depotwettbewerb USA 25 KW first-henri
first-henri:

So, moin Jungs !

 
22.06.03 06:48
#76
Auf eine neue spannende Woche mit weniger Ausfällen, sah ja alles ganz schön rot aus ...ich riskier's und setze alles nochmal..4 Werte sind noch im flatdepot und sollen belohnt werden..1 Hartcorezock kommt auch mit rein...

Bestand:
ACLA  4000 x  4,25 = 17000,00  SL bleibt
GENR  7050 x  2,29 = 16144,50  SL bleibt
AVCI  2900 x  5,84 = 16936,00  SL bleibt
TMR   4300 x  4,04 = 17587,00  SL NEU 3,68
CASH               = 62830,04

KAUF:
INGN  1550 x  5,00 =  7750,00  SL 4,50
FMXI  2600 x  3,00 =  7800,00  SL 2,70
ACTU  2500 x  3,15 =  7875,00  SL 2,84
NTPA  1800 x  4,34 =  7812,00  SL 3,91
FMT    560 x 14,02 =  7851,20  SL 12,62
IPIX  1650 x  4,74 =  7821,00  SL 4,27
KERX  4000 x  2,01 =  8040,00  SL 1,81
KIWI 49255 x  0,16 =  7880,80  SL 0,14

Wünsche allen eine schöne Woche mit Erfolg !

Greetz f-h  


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Depotwettbewerb USA 25 KW big lebowsky
big lebowsky:

Oho,f-h

 
22.06.03 13:23
#77
direkt nach dem Boxen aktiv gewesen.Passt ja,Du bist auch schwer angeschlagen(ggg-ich darf das,als Letzter).

Ich verkaufe noch INAP 5000 + 1.26 = 6.300 + Cash Verkauf RAEE 7.400= 13.700


Neue Positionen:


1000  CHINA    KK 7.29    Wert: 7.290,--
1000  INGN     KK 5.00    Wert: 5.000,--
47000 GMED     KK 0.03    Wert: 1.410,--


Alles andere bleibt;bitte auch die "alten" SL.

Schönen Sonntag noch B.L.            
Depotwettbewerb USA 25 KW big lebowsky
big lebowsky:

Eskimato,Scusi

 
22.06.03 17:00
#78
habe zu viel Biotech. TAUSCHE: INGN gegen SWIR.

Also: Keine 1000 INGN sondern
            807 SWIR zu 6.19(KK)  Wert 4.995,33

Die restlichen 4.67 sind für den Spielleiter ggg B.L.
Depotwettbewerb USA 25 KW Eskimato

Moin Grueni.

 
#79
TGAL is noch on watch, oder? Ich frag nur mal dumm nach, ob Du alle ehemaligen Depotwerte auch langfristig beobachtest.

Gruss E.

Adept Technology Selected by Tegal's Sputtered Films Subsidiary to Provide Automated Reticle Handling for Thin-Film Deposition Tool Thin-Film Deposition Tool to Include Adept's Reticle Loading Front-End Module, Integrated Robot, Loadport, I/O and Hos  


LIVERMORE, Calif., Jul 14, 2003 (BUSINESS WIRE) -- Adept Technology, Inc.
(OTCBB:ADTK.OB), a leading manufacturer of flexible automation for the
semiconductor, electronics, fiber optic, telecommunications, and life sciences
industries, today announced that the Sputtered Films subsidiary of Tegal
Corporation (Nasdaq: TGAL), a leading semiconductor manufacturer, has selected
Adept Technology to provide automated reticle handling for its thin-film
deposition tool.

Tegal's Sputtered Films Endeavor EUVL tool will utilize the new Adept Reticle
Loading Front-End Module (RLFEM), which includes Adept robots, controls,
software and clean air system technology. The Adept RLFEM(TM) platform is the
only reticle handling front-end platform that incorporates the control of robot,
end-effector, SMIF pod, I/O and host connectivity in a single cell controller
and software application environment, which increases reliability, simplifies
system maintainability, and lowers overall cost of ownership.

"Sputtered Films is a leading provider of advanced technology, thin-film
deposition semiconductor process tools and we are excited about partnering with
them to develop a reticle handling platform that meets their specific
requirements," said Charlie Duncheon, executive vice president of Adept
Technology.

"Adept Technology's innovative designs, solid record for product reliability,
and excellent customer service made them an attractive choice for us," said
Carole Anne Demachkie, general manager of Sputtered Films. "We look forward to
the receipt of the automated handling platform they've designed to interface
with our state-of-the-art Endeavor EUVL tool."

The Adept RLFEM(TM) platform provides fully automated transfer of photomasks
between reticle SMIF-pods and SFI's thin-film deposition process tool. It
utilizes an Adept wafer and reticle handling robot, the Adept SMIF-EZ load port
and a reticle flipping station. It also utilizes Adept's AIM SemiWare(TM), a
patented, database-driven application development environment which interfaces
with the host controller through either RS-232 or SECS/GEM protocols. The Adept
RLFEM platform has a compact but flexible design and meets stringent ISO Class 2
cleanliness standards. It features a clean, edge-contact reticle end-effector,
independent reticle flip station and single cell controller for all robot,
loadport, I/O and host controller connectivity.

Tegal Corporation, headquartered in Petaluma, Calif., is a leading designer and
manufacturer of plasma etch and deposition systems used in the production of
MEMS, smart cards, opto-telecom devices, integrated circuits (ICs), and other
related microelectronics devices. Both etching and deposition are key process
steps and must be repeated multiple times in the production of these devices.
Tegal markets and services its systems in all major IC-producing regions of the
world. More information is available on the Internet at: www.tegal.com.

Adept Technology designs, manufactures and markets factory automation components
and systems for the fiber optic, telecommunications, semiconductor, automotive,
food and durable goods industries throughout the world. Adept's robots,
controllers, and software products are used for small parts assembly, material
handling and ultra precision process applications. Our intelligent automation
product lines include industrial robots, configurable linear modules, flexible
feeders, semiconductor process components, nanopositioners, machine controllers
for robot mechanisms and other flexible automation equipment, machine vision,
systems and software, application software, and simulation software. Founded in
1983, Adept is America's largest manufacturer of industrial robots. More
information is available at www.adept.com.

This press release contains certain forward-looking statements that involve a
number of risks and uncertainties. Actual results could vary for a number of
reasons, including, but not limited to, the potential delays associated with the
development and introduction of new products or software releases; rapid
technological change within the company's industry; and the potential that our
new or existing products may contain defects, errors or performance problems.

For a discussion of additional risk factors relating to Adept's business, see
Adept's annual report on Form 10-K for the fiscal year ended June 30, 2002, as
amended, and Adept's quarterly reports on Form 10-Q for the quarters ended
September 28, 2002, as amended, December 28, 2002, as amended, and March 29,
2003, including the discussion in Management's Discussion and Analysis of
Financial Condition and Results of Operations contained therein.

The Adept logo is a registered trademark of Adept Technology, Inc. Adept, Adept
RLFEM, Adept SMIF-EZ, and Adept AIM SemiWare are trademarks of Adept Technology.
All other trademarks are owned by their respective companies.

SOURCE: Adept Technology, Inc.






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